Creating the Future
Undertake advanced research into materials and device technologies for future cutting-edge semiconductor wafer processes.
The teams of top engineering talent at the lab conduct pioneering TCAD-based device research on extremely low-power applications, and advanced model and metrology development for the Optical Proximity Correction (OPC) used in semiconductor device manufacturing.
TCAD: The lab focuses on the development of Technology Computer Aided Design (TCAD) models and simulation software for deploying advanced manufacturing processes for semiconductor devices and materials. SDL supports logic, memory, and CIS technology development, as well as the development of compact models for advanced logic and memory technology. The activities also include conducting pioneering TCAD-based device research on extremely low-power applications and neuromorphic computing.
OPC: Optical Proximity Correction (OPC) focuses on computational lithography development including advanced simulation, correction and inverse lithography technology.
SIMEX: “Simulation Initiated Material Exploration (SIMEX) team leads discovery of novel materials for next generation ultrafast and low-power memory.”
Logic Path Finding Group: “Innovating for future semiconductor Logic technologies, and pushing the boundaries of Moore’s Law”
Logic Path Finding Group: “Innovating for future semiconductor Logic technologies, and pushing the boundaries of Moore’s Law”
The Device Lab was initiated in January 2011 and is based in Silicon Valley. The lab focuses on the development of Technology Computer Aided Design (TCAD) models and simulation software for deploying advanced manufacturing processes for semiconductor devices and materials. SDL supports logic, memory and LED technology development, as well as the development of compact models for advanced logic and memory technology.