When you need to move mountains of data - whether for advanced graphics, artificial intelligence or no-compromise servers and data centers - you need Samsung's High Bandwidth Memory. Our innovative HBM technology combines the world's fastest DRAM with up to 410 gigabytes per second of bandwidth in a space-saving and energy-efficient 3D package. This data sheet takes an in-depth look at Samsung's HBM technology.
Samsung's High Bandwidth Memory makes quick work of artificial intelligence, Big Data analytics and other high-performance computing tasks. But we cannot do it alone. Together with our strong ecosystem partnerships, Samsung's HBM technology handles the heaviest data loads in a compact, energy-efficient format that's ideal for graphics processors or data centers.
Our latest HBM devices use eight vertically-stacked 8-gigabyte chips connected by up to 40,000 through silicon via (TSV) data paths to create compact, energy-efficient multi-chip packages that are ideal for space-constrained graphics processing units and data centers.
With the world's fastest DRAM and unprecedented bandwidth up to 410 gigabytes per second, and our third-generation HBM2E technology is ready to handle even the most demanding tasks. Since its introduction in June 2016, Samsung has been making headlines with this innovative, new technology.
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